Betegnelse
Parameter
Standard
Min
A,B,C
Plated through hole
Aspect rate
1:8
1:12
Finished hole
250 µm
150 µm
Annularring
100 µm
Solder pad
600 µm
450 µm
D
Mechanical drilled blind via
1 : 1
1: 1
(After pressing)
E
Laser drilled blind via
75 µm
50 µm
225µm
200 µm
F
Conductor, outer layer
Width
125 µm
Isolation
G
Conductor, inner layer
70 µm
H
Conductor/Solder pad – Contour
Space
400 µm
I
Conductor/Solder pad - Hole
275 µm
225 µm
J
Solder mask– Solder pad
Solder mask
Unplated hole
Legend – Solder mask